Analyse the surface of your wire off-line : how does the WIRE360 work ?

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Our offline version of the SQMF, the WIRE360, has recently been launched !

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The SQMF is designed to detect defects such as scratches, die marks, dents, blisters or particles that can appear on the surface of a wire/cable/tube during the manufacturing process, combined with the new WS bench, you have an ideal offline solution for analysing the surface of your samples and improving quality control.

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Find out now how to check your wire samples quickly and efficiently !

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Learn more about our solutions :

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Discover the Wire 360 : click here

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Discover the SQM-F: click here

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All our products for wire, cable and tube measurement : click here

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